/ SEMICONDUCTOR & ELECTRONICS

Root Cause Investigations for Semiconductor & Electronics Quality

When a lot fails final test or a customer return lands on your desk, your team needs to trace the failure across process, equipment, and materials—fast.

The Cost of Traditional Investigations

The Problem

  • Semiconductor fabrication generates enormous volumes of segmented process data.
  • Production handles constant quality escapes: lots failing final test, 8Ds, and holds.
  • The challenge is connecting disparate systems (MES, SPC, maintenance logs).

The Impact

  • Teams manually pull cross-reference timestamps in spreadsheets.
  • Complex failures span obscure interactions between recipes, tooling, and materials.
  • Manual analytical approaches are slow and produce incomplete causal chains.

Lattice Root Cause

  • Lattice auto-indexes evidence across all your factory systems out-of-the-box.
  • Agentic AI traverses engineering data to build structured causal analyses.
  • Eliminates weeks of manual data joining and narrative drafting.
MESExecution
FDCFault Detection
SPCQuality Control
Lattice Process Graph
Investigative ReportEvery causal path, fully audit-ready.
Process GraphUnified causal fault trees.
/ Applications

Core Investigations

Systems designed to handle the highest stakes in the semiconductor & electronics industry.

01

Customer Return / 8D Investigations

Structured failure analysis for customer-reported defects, with full traceability from return data to manufacturing history.

02

Lot Failure & Yield Excursion Investigations

Investigate why a lot failed final test or yield dropped, tracing across process steps, equipment, and materials.

03

Process Excursion Root Cause

When SPC flags an out-of-control process, investigate the causal chain across equipment, recipe, and environmental factors.

04

Incoming Material Investigations

Investigate whether incoming wafer, substrate, or component quality issues are causing downstream failures.

05

Reliability & Qualification Failures

Investigate failures during qualification, burn-in, or reliability testing, connecting to process and materials data.

06

Assembly & Packaging Failure Analysis

Investigate defects in die attach, wire bond, encapsulation, or other back-end processes.

Produce Investigations That Hold Up Under Scrutiny

Lattice helps quality teams produce comprehensive, defensible investigations. Faster than manual methods and more rigorous than ad-hoc processes.